三维集成大功率同步整流器的研究与设计  

Research and Design of 3D Integrated High Power Synchronous Rectifier

作　　者：杨勋勇 王建卫 张涵 马奎 杨发顺 Yang Xunyong;Wang Jianwei;Zhang Han;Ma Kui;Yang Fashun(Guizhou University of Engineering science,Bijie Guizhou,551700;College of Big Data and Information Engineering,Guizhou University,Guiyang Guizhou,550025)

机构地区：[1]贵州工程应用技术学院,贵州毕节551700 [2]贵州大学大数据与信息工程学院,贵州贵阳550025

出　　处：《电子测试》2022年第3期10-13,共4页Electronic Test

摘　　要：实现同步整流能够有效提高次级整流效率,并且有利于实现电源模块的小型化。将同步整流器中的控制电路和整流桥分别制作在两层芯片上,然后堆叠两层芯片并通过TSV实现层间信号互连,不仅能进一步提高集成度,还能有效降低引线延迟和功耗。设计了一种大功率同步整流器,仿真实现了输出电压为5V、最大输出电流为13.38A、输出电压和输出电流的温度系数分别为37.289ppm和37.266ppm、负载调整率为7.96mV/A。根据大功率同步整流器电路的功能、规模以及热稳定性等因素,合理规划布局,将四个整流器件规划在整流芯片上、控制电路和高压降压电路以及开关电路规划在控制芯片上,配以相应的信号互连TSV和散热TSV,设计了三维集成大功率同步整流器的版图,对两层芯片以及三维堆叠芯片进行了DRC、LVS以及三维电气互连验证,验证结果正确。Synchronous rectification can effectively improve the secondary rectification efficiency and facilitate the miniaturization of the power module.The control circuit and the rectifier bridge in the synchronous rectifier are respectively fabricated on two layers of chips,and then the two layers of chips are stacked and the inter-layer signal interconnection is realized by the TSV,which not only further improves the integration degree,but also effectively reduces the lead delay and power consumption.A high-power synchronous rectifier is designed.The simulation achieves an output voltage of 5V,a maximum output current of 13.38A,a temperature coefficient of output voltage and output current of 37.289ppm and 37.266ppm,and a load regulation rate of 7.96mV/A.According to the function,scale and thermal stability of the high-power synchronous rectifier circuit,the layout is rationally planned,and the four rectifier devices are planned on the rectifier chip,the control circuit and the high-voltage step-down circuit,and the switching circuit are planned on the control chip.Corresponding signal interconnection TSV and heat dissipation TSV,the layout of three-dimensional integrated high-power synchronous rectifier is designed,and the two-layer chip and three-dimensional stacked chip are verified by DRC,LVS and three-dimensional electrical interconnection,and the verification results are correct.

关 键 词：三维集成 大功率 同步整流 TSV 电气连接 

分 类 号：TM46[电气工程—电器]