晶圆测试异常之烧针问题分析研究  

Research on the Needle Burning of Abnormal Circuit Probing

作　　者：陈瑜清 冯磊 Chen Yu-qing;Feng Lei(Wuxi CMC Electronics Co.,Ltd.,Jiangsu Wuxi 214072)

机构地区：[1]无锡中微腾芯电子有限公司,江苏无锡214072

出　　处：《电子质量》2022年第1期22-26,共5页Electronics Quality

摘　　要：在晶圆测试过程中,难免会出现一些异常问题,其中"探针(Probe needle)烧针现象"是个较严重的测试异常。由于探针针尖与电源PAD接触面积较小,数百毫安(m A)电流会将探针针尖氧化,这被称为烧针。该文通过案例分析,烧针现象和针尖清针的必然联系以及为了避免烧针,程序开发方面的一些注意事项。In the process of wafer testing, some abnormal problems wil inevitably occur. Among them, the "probe needle burning phenomenon" is a more serious test abnormality. Due to the small contact area between the probe tip and the power supply PAD, a current of hundreds of milliamps(mA) will oxidize the probe tip, which is called needle burning. This article analyzes the case, the inevitable connection between needle burning phenomenon and needle tip clearing, and some precautions in program development in order to avoid needle burning.

关 键 词：晶圆测试 烧针 清针 

分 类 号：TN407[电子电信—微电子学与固体电子学]