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作 者:黄俊 曹秀华 宁礼健 张勇强 梁金葵 HUANG Jun;CAO Xiuhua;NING Lijian;ZHANG Yongqiang;LIANG Jinkui(State Key Laboratory of Advanced Materials and Electronic Components,Guangdong Fenghua Advanced Technology Holding Co.,Ltd.,Zhaoqing 526020,Guangdong Province,China)
机构地区:[1]广东风华高新科技股份有限公司新型电子元器件关键材料与工艺国家重点实验室,广东肇庆526020
出 处:《电子元件与材料》2022年第2期213-220,共8页Electronic Components And Materials
摘 要:多层陶瓷电容器(MLCC)端电极低温烧结技术仍是目前研究的重点与难点。为了改善MLCC低温烧结铜端电极的烧结形貌与质量,开发出适用于低温烧结的端电极铜浆的新型玻璃粉,探讨了玻璃粉的转变温度、含量、粒径以及玻璃粉与陶瓷基片的烧结润湿性与铜浆烧结特性之间的关系。此外,研究了铜粉形貌、粒径等对端电极烧结特性的影响。结果表明:当玻璃粉转变温度为577.6℃,铜浆中玻璃粉含量为质量分数10%(D_(50)=2.0μm),类球形铜粉Cu-2和板状铜粉Cu-4的质量比为6∶4(D_(50)=1.4μm)时,得到烧结质量最佳的MLCC铜端电极,其致密度高达99.87%。Low-temperature sintered technology is still a great challenge for the terminal electrode of multilayer ceramic capacitor(MLCC).In order to improve the morphology and quality of the low-temperature sintered terminal electrode,a novel glass powder for low-temperature sintered copper paste were developed,and the relationship between the glass powder parameters,such as the transition temperature,content,particle size,sintering wettability with the ceramic substrate,and sintering characteristics were discussed.Besides,the impact of the shape and particle size of the copper powder on the sintering characteristics of the terminal electrode were investigated.The results show that an excellent sintered terminal electrode with the density up to 99.87%can be obtained with suitable glass powder(the transition temperature is 577.6℃,the content is 10%,D_(50)=2.0μm)and the ratio of copper powder Cu-2 to Cu-4 is 6∶4(D_(50)=1.4μm).
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