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作 者:冯叶琳 丁运虎[1] 叶成茁 马爱华[1] 黄兴林[1] 王柱元 黄朝志[1] FENG Yelin;DING Yunhu;YE Chengzhuo;MA Aihua;HUANG Xinglin;WANG Zhuyuan;HUANG Chaozhi(Wuhan Research Institute of Materials Protection,Wuhan 430030,China)
出 处:《电镀与精饰》2022年第3期23-28,共6页Plating & Finishing
摘 要:比较了电气用铝排(6101铝合金)无氰镀铜与氰化镀铜后的镀层外观、金相、孔隙率、接触电阻、可焊接性、极化曲线的差异,并在不同工艺及厚度的镀铜层上电镀5μm厚度的锡层,通过Tafel极化曲线、中性盐雾试验、高温高湿试验对其耐腐蚀性能进行评估。结果表明,无氰镀铜光泽度好,接触电阻低,但整平能力、深度能力、可焊接性和孔隙率不如氰化镀铜;两种镀铜层厚度小于3μm时,镀铜工艺及厚度对镀锡层耐中性盐雾性能影响较大,对镀锡层的耐高温、高湿性能几乎没有影响。The differences in appearance,metallography,porosity,contact resistance,weldability and polarization curve of aluminum busbars(6101 aluminum alloy)after cyanide-free copper plating and cyanide copper plating are compared.A 5μm thick tin layer is electroplated on copper,and its corrosion resistance is evaluated through Tafel polarization curve,neutral salt spray test,high temperature and high humidity test.The results show that the cyanide-free copper plating has the better gloss and the lower contact resistance,but the leveling ability,depth ability,solderability,and porosity are not as good as cyanide copper plating.When the thickness of the two copper plating layers is less than 3μm,the copper plating process and the thickness has a greater impact on the neutral salt spray resistance of the tin-plated layer,and has almost no effect on the high-temperature and high-humidity resistance of the tin-plated layer.
分 类 号:TQ153.1[化学工程—电化学工业]
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