基于摩擦磨损的KDP晶体固结磨料抛光垫优化  

Optimization of Fixed Abrasive Polishing Pad for KDP Crystal Based on Friction and Wear

作　　者：熊光辉 李军[1] 李凯旋 吴成 于宁斌 高秀娟 XIONG Guanghui;LI Jun;LI Kaixuan;WU Cheng;YU Ningbin;GAO Xiujuan(College of Mechanical and Electrical Engineering,Nanjing University of Aeronautics and Astronautics,Nanjing 210016,China)

机构地区：[1]南京航空航天大学机电学院,南京210016

出　　处：《人工晶体学报》2022年第2期271-281,共11页Journal of Synthetic Crystals

基　　金：国家自然科学基金联合基金(U20A20293);国家自然科学基金面上项目(52075318);江苏省“六大人才高峰”高层次人才项目(JXQC-010);中国科学院功能晶体与激光技术重点实验室开放课题(FCLT201803)。

摘　　要：本文通过固结磨料球与KDP晶体对磨的单因素试验探究固结磨料球中反应物种类、磨粒浓度、反应物浓度、基体硬度对摩擦系数、磨痕截面积和磨痕处粗糙度的影响,试验结果表明:KHCO_(3)固结磨料球对磨后磨痕对称性好,磨痕处的粗糙度值低;磨痕截面积随磨粒和反应物浓度的增加而增大,随基体硬度的增大而降低;磨痕处粗糙度随磨粒和反应物浓度的增加先降低后上升,随基体硬度的增大先上升后降低;摩擦系数受磨粒和反应物浓度影响不明显,随基体硬度的增大而降低。选择KHCO_(3)作为反应物,Ⅰ基体,磨粒浓度为基体质量的100%,反应物浓度为15%制备固结磨料球与KDP晶体对磨后的磨痕轮廓对称度好且磨痕处粗糙度值低,以该组分制备固结磨料垫干式抛光KDP晶体,可实现晶体表面粗糙度Sa值为18.50 nm,材料去除率为130 nm/min的高效精密加工。In this paper,the effects of reactant type,abrasive concentration,reactant concentration and matrix hardness on friction coefficient,cross-sectional area of wear mark and roughness at wear mark were studied by single factor experiments of fixed abrasive ball grinding with KDP crystal.The test results show that:KHCO_(3) fixed abrasive ball has good symmetry of the wear scar,small roughness value at the wear scar,and small damage depth of KDP crystal.The cross-sectional area of wear scar increases with the increase of the concentration of abrasive and reactants,and decreases with the increase of the hardness of the matrix.The roughness at the wear scar decreases and then increases with the increase of the concentration of abrasive and reactant,and first increases and then decreases with the increase of the hardness of the matrix.The friction coefficient is not significantly influenced by the concentration of abrasive and reactants,but decreases with the increase of the hardness of the matrix.The abrasive scar contour symmetry is good and the roughness value at the wear scar is low when the composition of fixed abrasive ball is KHCO_(3) as the reactant,Ⅰmatrix,the abrasive concentration is 100%of the matrix mass,and the reactant concentration is 15%.The fixed abrasive pad was prepared from the components above,and the KDP crystal was polished by the pad.High efficiency and high precision machining can be achieved with surface roughness Sa of 18.5 nm and material removal rate of 130 nm/min.

关 键 词：KDP晶体 固结磨料垫 晶体加工 干式抛光 摩擦磨损 反应物 

分 类 号：TH117.1[机械工程—机械设计及理论] TG74[金属学及工艺—刀具与模具]