薄膜有机集成电容的制作工艺  

Manufacturing Process of Thin Film Organic Integrated Capacitors

作　　者：张健[1] 王春富[1] 王贵华 王文博 李彦睿[1] 秦跃利[1] ZHANG Jian;WANG Chunfu;WANG Guihua;WANG Wenbo;LI Yanrui;QIN Yueli(The 29th Research Institute of CETC,Chengdu 610036,China)

机构地区：[1]中国电子科技集团公司第二十九研究所,四川成都610036

出　　处：《电子工艺技术》2022年第2期71-73,80,共4页Electronics Process Technology

摘　　要：以PI-5型聚酰亚胺(PI)电子涂料为介质层,在99瓷氧化铝陶瓷基片表面通过磁控溅射、光刻、电镀、蚀刻等传统薄膜电路工艺制作有机集成电容。分别研究了PI旋涂转速、旋涂时间、热处理制程等参数对PI厚度和均匀性的影响,最终通过优化过程工艺参数,得到厚度与设计值相符的PI膜层,且膜厚均匀性优于±5%,有机电容的容值精度优于±5%。PI有机电容与薄膜及半导体电路工艺高度兼容,在集成无源器件(IPD)制造中有着广阔的应用前景,有利于新一代系统的微型化、多功能和高密度集成。Using PI-5 type polyimide electronic paint as dielectric layer,organic integrated capacitors are fabricated on the surface of 99%alumina ceramic substrate by traditional thin film circuit processes such as magnetron sputtering,photolithography,electroplating,and etching.The influence of PI spin coating speed,spin coating time,heating process and other parameters on the thickness and uniformity of PI is studied.Finally,by optimizing the process parameters,the PI film with a thickness consistent with the design value is obtained.The uniformity of the film thickness is better than ±5%,and the capacitance accuracy of organic capacitors is better than ±5%.It can be realized that PI organic capacitors are highly compatible with thin film and semiconductor processes,and have broad application prospects in integrated passive device manufacturing,which is conducive to the miniaturization,multi-function and high-density integration of the new generation system.

关 键 词：聚酰亚胺(PI) 有机电容 薄膜电路 集成无源器件(IPD) 

分 类 号：TN405[电子电信—微电子学与固体电子学]