厚铜电源板的薄介质技术  

Thin Dielectric Technology of Heavy Copper PCB

作　　者：曾福林[1] 安维[1] 李冀星 ZENG Fulin;AN Wei;LI Jixing(Zhongxing Telecommunication Equipment Corporation,Shenzhen 518057,China)

机构地区：[1]中兴通讯股份有限公司,广东深圳518057

出　　处：《电子工艺技术》2022年第2期116-119,共4页Electronics Process Technology

摘　　要：电源板由于载电流及耐电压的需求,对铜厚及介质层厚度都有着特殊的要求。随着电源产品大功率和小型化方向的发展,要求电源PCB的板厚要尽量小。重点研究了厚铜电源板薄介质的技术可行性,对厚铜板的设计选型具有重要指导意义。Due to the requirements of current and voltage resistance,the PCB of power supply has special requirements for the thickness of copper and the thickness of the dielectric layer.With the development of high-power and miniaturization of the power supply,the thickness of the power supply PCB is also required to be as small as possible.The technical feasibility of thin dielectric technology of heavy copper PCB is studied,which has important guiding significance for the design and selection of heavy copper PCB.

关 键 词：PCB 厚铜 薄介质 

分 类 号：TN605[电子电信—电路与系统]