PCB精细阻焊工艺能力分析  

Analysis of Process Capability of PCB Fine-Soldering Mask Technology

作　　者：徐伟明[1] 李冀星 曾福林[1] 安维[1] XU Weiming;LI Jixing;ZENG Fulin;AN Wei(Zhongxing Telecommunication Equipment Corporation,Shenzhen 518057,China)

机构地区：[1]中兴通讯股份有限公司,广东深圳518057

出　　处：《电子工艺技术》2022年第2期120-124,共5页Electronics Process Technology

摘　　要：由于目前电子产品便携化地发展,单板组装密度越来越高,相关芯片元器件也趋向小型化、精密化。引线间距0.4 mm的QFN和BGA芯片应用越来越多,引线间距变小,也就使得PCB的焊盘阻焊桥制作空间减小,阻焊桥无法制作、阻焊桥掉落和绿油上焊盘的问题突出,制约了精密芯片的应用。PCB阻焊桥的制作工艺能力是一个综合能力的体现,材料技术、人员技能、设备能力和过程控制能力都会影响阻焊桥的质量,需要全方位的能力提升才能使PCB的制造技术跟得上芯片封装技术的步伐。本次试验选取一家技术水平中等偏上的PCB板厂测试当前的阻焊对位精度能力和阻焊桥制作能力,以了解当前的PCB精细阻焊工艺能力。Due to the current portability development of electronic products,the density of single board assembly is increasing,and the related chip components are also becoming smaller and more precise.As 0.4 Pitch QFN and BGA chips are used more and more,the spacing between the pins becomes smaller,thus reducing the space for making the solder mask bridge of the PCB.As a result,The problems of unable to make solder mask bridge,solder mask bridge dropping and green oil on the solder pad are prominent,which constrain the application of precision chips.The manufacturing process capability of solder mask bridge reflects its comprehensive capability.The quality of the solder mask bridge will be affected by material technologies,personnel skills,equipment capabilities and process control capabilities.The PCB manufacturing technology can keep up with the chip encapsulation technology only after the all-round capability improvement.In this test,a PCB board factory with medium technical level is selected to test the current solder mask alignment precision capability and solder mask bridge manufacturing capability,so as to learn about the current PCB fine-soldering mask process capability.

关 键 词：PCB 阻焊桥 对位能力 表面处理 

分 类 号：TN605[电子电信—电路与系统]