多通道SiC固态功率控制器热仿真及设计优化  

Thermal Simulation and Design Optimization of Multi-Channel SiC Solid-State Power Controller

作　　者：赖耀康 王浩南 曹玉峰 王梓丞 叶雪荣[2] 翟国富[2] LAI Yaokang;WANG Haonan;CAO Yufeng;WANG Zicheng;YE Xuerong;ZHAI Guofiu(Bejjing Keytone Electronic Relay Co.,Ltd.,Beijing 100176,China;Electrical and Electronic Reliability Institute,Harbin Institute of Technology,Harbin 150001,China)

机构地区：[1]北京市科通电子继电器总厂有限公司,北京100176 [2]哈尔滨工业大学电器与电子可靠性研究所,黑龙江哈尔滨150001

出　　处：《电器与能效管理技术》2022年第2期42-45,94,共5页Electrical & Energy Management Technology

基　　金：装备发展部预研项目(31512040201-3)。

摘　　要：随着SiC MOSFET的发展,以该器件作为核心部分的多通道SiC固态功率控制器逐渐应用于高功率密度领域。由于其温升和极端环境温度更高,所以对产品的热管理需求也随之提升。因此,准确评估产品内部热分布是实现高性能多通道固态功率控制器设计的前提。以额定电压270 V,额定电流240 A的12路固态功率控制器为对象,分析其热失效机理,建立简化有限元模型。分别对120 A.180 A降额工作情况进行稳态与瞬态的热仿真及验证。对240 A满载工作情况进行热仿真,根据仿真结果及实际情况做出热设计优化。最后,进行优化产品的满载测试,验证热仿真及设计优化的正确性。With the development of SiC MOSFET,the multi-channel SiC solid-state power controller with this device as the core part is gradually applied in the field of high-power density.Due to its higher temperature rise and extreme ambient temperature, the demand for thermal management of products has also increased.Therefore, an accurate assessment of the internal heat distribution of the product is a prerequisite for the design of a high-performance multi-channel solid-state power controller.This article took the 12-channel solid-state power controller with rated voltage of 270 V and rated current of 240 A as the object, analyzed its thermal failure mechanism, and established a simplified finite element model.The steady-state and transient thermal simulations and verifications of the 120 A and 180 A derating working conditions were carried out respectively.The thermal simulation on 240 A full-load working conditions was performed, and thermal design optimization was made based on the simulation results and actual conditions.Finally, the full-load test of the optimized product was carried out to verify the correctness of the thermal simulation and design optimization.

关 键 词：SIC 固态功率控制器 热失效机理 热仿真 设计优化 

分 类 号：TM571[电气工程—电器]