纳米颗粒材料作中间层的烧结连接及其封装应用研究进展  

Research Progress in Sintering-bonding with Nanoparticle Materials as Interlayer and Its Packaging Application

作　　者：贾强 邹贵生[1] 张宏强 王文淦 邓钟炀 任辉 刘磊[1] 彭鹏[2] 郭伟[2] JIA Qiang;ZOU Guisheng;ZHANG Hongqiang;WANG Wengan;DENG Zhongyang;REN Hui;LIU Lei;PENG Peng;GUO Wei(Department of Mechanical Engineering,Tsinghua University,Beijing 100084;School of Mechanical Engineering and Automation,Beihang University,Beijing 100191)

机构地区：[1]清华大学机械工程系,北京100084 [2]北京航空航天大学机械工程及自动化学院,北京100191

出　　处：《机械工程学报》2022年第2期2-16,共15页Journal of Mechanical Engineering

基　　金：国家重点研发计划(2017YFB1104900);国家自然科学基金(51775299,52075287,51520105007)资助项目。

摘　　要：随着第三代功率半导体器件的发展,以SiC为代表的宽禁带半导体芯片在大功率电力电子器件中扮演了越来越重要的角色。然而与传统Si芯片匹配的封装材料难以满足其高温服役的要求,成为功率电子器件应用的短板。纳米颗粒材料作中间层用于电子封装能够实现低温连接、高温服役,是目前封装材料的研究热点。本文综述了当前纳米颗粒材料作中间层的存在形式,重点分析单质纳米颗粒烧结连接的优势、影响因素以及局限性,系统阐述了复合纳米颗粒烧结连接的最新进展以及发展趋势,旨在促进纳米颗粒材料作中间层在电子封装中的应用。With the development of third-generation power semiconductor devices,the wide bandgap semiconductor chips represented by SiC are playing an increasingly important role in high-power power electronic devices.However,the packaging materials matched with traditional Si chips cannot meet their high-temperature service requirements and become a shortcoming in the application of power electronic devices.Nanoparticle materials used as an interlayer for electronic packaging can achieve low-temperature bonding and high-temperature service,which is a current research hotspot of packaging materials.This paper reviews the types of nanoparticle materials as the interlayer,focusing on the analysis of the advantages,influencing factors and limitations of nanoparticle of elementary substance for sintering-bonding,and systematically expounds the latest progress and development trend of composite nanoparticle for sintering-bonding,aiming to promote the application of nanoparticle material as an interlayer for electronic packaging.

关 键 词：纳米颗粒 中间层 微纳连接 低温烧结 电子封装 

分 类 号：TG47[金属学及工艺—焊接]