紫外光活化低温键合研究进展  

Research Progress on Ultraviolet Activated Low-temperature Bonding

作　　者：王晨曦[1] 戚晓芸 方慧 康秋实 周诗承 许继开 田艳红[1] WANG Chenxi;QI Xiaoyun;FANG Hui;KANG Qiushi;ZHOU Shicheng;XU Jikai;TIAN Yanhong(State Key Laboratory of Advanced Welding and Joining,Harbin Institute of Technology,Harbin 150001)

机构地区：[1]哈尔滨工业大学先进焊接与连接国家重点实验室,哈尔滨150001

出　　处：《机械工程学报》2022年第2期122-135,共14页Journal of Mechanical Engineering

基　　金：黑龙江省自然科学基金资助项目(LH2019E041)。

摘　　要：随着电子及生物医疗元器件朝着微型化、便携式及多功能性的发展,连接(电子领域内常被称为“键合”)已成为材料或结构一体化集成不可或缺的关键环节。表面活化键合避免了传统焊接工艺中的高温,能够在较低温度条件下使热膨胀差异较大的材料或结构实现可靠连接,在微电子、微机电系统、光电子及微流控芯片等制造领域极具应用潜力,其中紫外光作为一种简易高效的表面活化手段近年来备受关注。本文对紫外光活化低温键合相关的研究进展进行综述,主要介绍了紫外光的基本性质,对有机及无机材料基板表面的作用效果,总结了面向微电子、微机电系统和光电子器件制造的紫外光表面活化晶圆键合成果,以及其在微流控器件封接、医用可植入器件制备中的应用实例,最后对该键合方法的未来发展和挑战进行了展望。With the diversification of electronic devices and bio-components functions,the integration of multi-materials or structures has become an integral part of device manufacturing.Reliable bonding between materials or structures with different properties can be realized at low temperature after UV(ultraviolet)activation.This efficient and simple bonding method is promising in device manufacturing in microelectronics,MEMS,optoelectronics,microfluidics,etc.Recent researches on the UV-activated lowtemperature bonding methods are reviewed.Firstly,the basic properties of UV and its activation impact on the surface of organic and inorganic materials are introduced.Additionally,the UV surface activated low-temperature wafer bonding methods are introduced in microelectronics,MEMS and optoelectronics manufacturing.Moreover,the critical joining technologies in the preparation of bio-chemical components such as microfluidics and implantable devices,flexible electronics,etc.,are summarized.Finally,the review provides an outlook on challenges in the UV surface activated low-temperature bonding technologies.

关 键 词：紫外光 表面活化 低温连接 晶圆键合 键合界面 

分 类 号：TG456[金属学及工艺—焊接]