极端温度环境Sn基焊点本构方程的研究进展  

Research Progresses on Reliability of Sn-based Solder Joints in Extreme Temperature Environment

作　　者：李胜利[1] 牛飘 杭春进[1] 田艳红[1] 崔宁 蒋倩 LI Shengli;NIU Piao;HANG Chunjin;TIAN Yanhong;CUI Ning;JIANG Qian(State Key Laboratory of Advanced Welding and Joining,Harbin Institute of Technology,Harbin 150001;China Great Wall Industry Corporation,Beijing 100089;China Great Wall Industry Corporation Navigation Co.,Ltd.,Beijing 100089)

机构地区：[1]哈尔滨工业大学先进焊接与连接国家重点实验室,哈尔滨150001 [2]中国长城工业集团有限公司,北京100089 [3]北京航天长城卫星导航科技有限公司,北京100089

出　　处：《机械工程学报》2022年第2期236-245,共10页Journal of Mechanical Engineering

基　　金：国家自然科学基金(51775141);黑龙江省“头雁”团队资助项目。

摘　　要：焊点在深空探测器的电子系统中承担机械支撑、电气连接和信号通道的作用,电子系统的失效也多由互连焊点的失效引起,这与钎料在不同温度载荷下力学行为和微观组织的变化有着重要的联系。目前焊点主要以Sn基钎料为主,且在−55~150℃温度范围内根据其力学性能构建黏塑性方程,如Anand、Garofalo-Arrheninus、Norton、Wiese模型等。但对小于−55℃温度环境下的钎料本构方程研究较少。通过对−55~150℃温度范围内现有的力学本构模型进行了综述,阐述在不同温度下力学性能和微观组织对焊点可靠性的影响,总结了目前面临的问题和挑战,最后对小于−55℃下Sn基钎料和焊点的力学本构模型研究进行了初步探索及展望。The solder joints played a crucial role for the provide mechanical,thermal and electrical continuity in electronics system for the deep space detector,the failure of the electronics system mainly caused by the failure of the solder joints,this result had an important relationship with the mechanical properties and microstructure evolution of the solder alloy under the various temperature conditions.Sn-based solder was widely used at the present,and the viscoplastic equation was established by the mechanical properties of the solder alloy,such as Anand,Garofalo-Arrheninus,Norton,Wiese model,etc.However,a few of studies about the constitutive equation of the solder alloy at extremely temperature(lower than−55℃)were investigated.The mechanical constitutive models in the temperature range from−55℃to+150℃were reviewed and elaborated the effects of mechanical property and microstructure on the solder joint reliability for different temperatures.The current problems and challenges were summarized,finally looked forward to the development trend of the mechanical constitutive model of the Sn-based solder and solder joint under extremely low temperature(lower than−55℃)

关 键 词：Sn基焊点 力学本构方程 力学行为 深空探测 

分 类 号：TG407[金属学及工艺—焊接]