DCS系统无铅焊接可靠性研究  

Study on Lead-Free Soldering Process Reliability of DCS

作　　者：涂德慧 戴晨阳 邹海明 钱瑞霞 夏晓麟 郭子波 Tu Dehui

机构地区：[1]浙江中控技术股份有限公司,浙江杭州310053

出　　处：《工业控制计算机》2022年第3期145-146,共2页Industrial Control Computer

摘　　要：通过近20年的发展,无铅焊接工艺已成熟。国内部分产品仍在采用的混合组装工艺在焊接BGA等器件时存在明显的风险。浙江中控无铅焊接工艺转换也证明无铅焊点可靠性有保障。Through the development of nearly 20 years,lead-free soldering process has been mature.There are obvious risks when BGA and other devices are entering a transition of mixed lead-free/tin-lead process which is still used in some domestic products.The transition of lead-free soldering process in Supcon also proves that the reliability of lead-free solder joint is guaranteed.

关 键 词：DCS(分布式控制系统) 无铅焊接 ROHS 可靠性 

分 类 号：TN05[电子电信—物理电子学] TG44[金属学及工艺—焊接]