AlN陶瓷烧结技术及性能优化研究进展  

Research progress on sintering technology and performance optimization of AlN ceramics

作　　者：王露露 马北越 刘春明 邓承继[3] 于景坤 Wang Lulu;Ma Beiyue;Liu Chunming;Deng Chengji;Yu Jingkun

机构地区：[1]东北大学材料科学与工程学院,辽宁沈阳110819 [2]东北大学冶金学院,辽宁沈阳110819 [3]武汉科技大学省部共建耐火材料与冶金国家重点实验室,湖北武汉430081

出　　处：《耐火材料》2022年第2期180-184,共5页Refractories

基　　金：国家自然科学基金资助项目(U20A20239)。

摘　　要：微电子技术的飞速发展对芯片基板和封装材料性能的要求越来越高。AlN陶瓷因其高热导率、高强度、线膨胀系数与硅接近、介电常数小、耐高温和耐腐蚀性能优异而被用作芯片基板和封装材料。主要从烧结技术和烧结助剂对AlN陶瓷性能影响方面综述了AlN陶瓷的研究进展,并指出了AlN陶瓷在制备及应用过程中存在的问题,展望了AlN陶瓷的发展趋势。The rapid development of microelectronics technology puts forward higher and higher requirements for the performance of chip substrates and packaging materials.AlN ceramics are used as chip substrates and packaging materials due to their high thermal conductivity,high strength,linear expansion coefficient close to silicon,low dielectric constant,and excellent high temperature resistance and corrosion resistance.The research progress of AlN ceramics in term of the influence of sintering technologies and sintering aids on their properties was reviewed.The problems during the preparation and application of AlN ceramics were pointed out,and the development trend was prospected.

关 键 词：ALN 烧结技术 烧结助剂 

分 类 号：TQ175[化学工程—硅酸盐工业]