Semi-custom methodology to fabricate transmission electron microscopy chip for in situ characterization of nanodevices and nanomaterials  

作　　者：YU BoCheng SUN Mei PAN RuHao TIAN JiaMin ZHENG FengYi HUANG Dong LYU FengJiao ZHANG ZhiTong LI JunJie CHEN Qing LI ZhiHong 

机构地区：[1]National Key Laboratory of Nano/Micro Fabrication Technology,School of Integrated Circuits,Peking University,Beijing 100871,China [2]Hefei National Laboratory for Physical Sciences at the Microscale,University of Science and Technology of China,Hefei 230026,China [3]Beijing National Laboratory for Condensed Matter Physics,Institute of Physics,Chinese Academy of Sciences,Beijing 100190,China [4]Key Laboratory for Physics and Chemistry of Nanodevices and Department of Electronics,Peking University,Beijing 100871,China

出　　处：《Science China(Technological Sciences)》2022年第4期817-825,共9页中国科学（技术科学英文版）

基　　金：supported by the National Key Research and Development Program of China (Grant No. 2016YFA0200802);the National Natural Science Fundation of China (Grant No. 11890672)

摘　　要：The fabrication of nanodevices on the delicate membrane window of the TEM(transmission electron microscopy)chip has the risk of breakage failure,limiting in-depth research in this area.This work proposed a methodology to address this issue,enabling secure in-situ transmission electron microscopic observation of many devices and materials that would otherwise be difficult to achieve.Combining semi-custom TEM chip design and front-side protected release technology,a variety of nanodevices were successfully fabricated onto the window membrane of the TEM chip and studied in situ.Moreover,the pressure tolerance of window membrane was investigated and enhanced with a reinforcing structure.As an example of typical applications,MoS;devices on the TEM chip have been fabricated and electron beam-induced gate modulation and irradiation damage effects,have been demonstrated.

关 键 词：in situ TEM TEM chip NANODEVICE membrane window NANOMATERIAL 

分 类 号：TN16[电子电信—物理电子学] TN40