无铅锡膏选择和评估方法  

Method for Selection and Evaluation of Leadfree Solder Paste

作　　者：冯卫国 Feng Weiguo

机构地区：[1]国电南瑞科技股份有限公司

出　　处：《丝网印刷》2022年第3期35-38,共4页Screen Printing

摘　　要：描述了电子产品在无铅工艺导入过程中,对于关键辅材锡膏的选择和评估方法。结合IPC有关标准,针对常见的锡膏测试项目,包括锡珠、润湿性、坍塌性、黏度、印刷性等,设计了一套相对定量的锡膏综合性能评估方法,供生产企业选择锡膏时参考借鉴。This paper describes the selection and evaluation method of the key auxiliary material solder paste in the lead-free process of electronic products.According to IPC standards,a set of relatively quantitative evaluation method for the comprehensive performance of solder paste is designed for common solder paste test items,including solder bead,wettability,collapse,viscosity,printability,etc.,which can be used for reference when manufacturing enterprises choose solder paste.

关 键 词：锡膏 无铅工艺 评估 

分 类 号：TN03[电子电信—物理电子学] TG42[金属学及工艺—焊接]