基于LED不同封装类型散热分析  

Heat Dissipation Analysis Based on Different LED Package Types

作　　者：宿文志 钱靖 吴义云 刘蕾 李昕淼 邹勇 SU Wenzhi;QIAN Jing;WU Yiyun;LIU Lei;LI Xinmiao;ZOU Yong(School of Math and Physics,Anhui University of Technology,Maanshan 243032,China)

机构地区：[1]安徽工业大学数理科学与工程学院,安徽马鞍山243032

出　　处：《中国照明电器》2021年第9期9-14,共6页China Light & Lighting

基　　金：安徽高校自然基金重点项目(KJ2018A0051);安徽省双基教学示范课程建设项目(2020-430);安徽工业大学省级大学生创新训练计划项目(S202010360385、S202110360324);安徽工业大学校级大学生创新训练计划项目(2021046Y)。

摘　　要：应市场要求,LED芯片功率不断增大,导致LED工作时结温升高,因此对产品的散热性能要求也越来越高。综合分析目前市场上LED灯的不同封装类型及研究现状后,本文基于Fluent有限体积方法对LED的SMD(表面贴片)封装和COB(板上芯片)封装进行散热分析。结果表明:3种不同结构的COB封装中,倒装COB封装散热效果最好,垂直结构COB封装次之,最后是正装COB封装,但无论哪种结构的COB封装,其散热效果均优于SMD封装。研究发现,随着基板尺寸的增大,3种结构COB封装的结温逐渐减小,但LED结温变化率也随基板尺寸增大而减小,散热效果提升不明显。According to the market requirements,the power of LED chip is increasing,resulting in the increasing junction temperature of LED,so the heat dissipation problem is becoming more and more prominent.After comprehensively analyzing the different packaging types and research status of LED lamps in the current market,this paper analyzes the heat dissipation of SMD(Surface Mounted Devices)packaging and COB(Chip On Board)packaging of LED based on finite volume method.The results show that for COB packages with different structures,flip COB package has the best heat dissipation effect,followed by vertical COB package,and formal COB package is the worst.However,no matter which structure COB package is,its heat dissipation effect is better than SMD package.It is found that with the increase of substrate size,the junction temperature of COB packages with three structures gradually decreases,but the change rate of LED junction temperature also decreases with the increase of substrate size,and the improvement of heat dissipation effect is not obvious.

关 键 词：LED封装 COB 结温 散热 热阻 

分 类 号：TN305.94[电子电信—物理电子学]