基于白光三角法的凸点封装高度测量仿真研究  

Simulation Research on Height Measurement of Bump Package Based on White Light Triangulation Method

作　　者：叶瑞乾 郑鹏 王磊 张滋黎 孟繁昌 YE Rui-qian;ZHENG Peng;WANG Lei;ZHANG Zi-li;MENG Fan-chang(School of Aerospace Engineering,Xiamen University,Xiamen 361000,China;Institute of Microelectronics of the Chinese Academy of Science,Beijing 100094,China)

机构地区：[1]厦门大学航空航天学院,福建厦门361101 [2]中国科学院微电子研究所,北京100094

出　　处：《光学与光电技术》2022年第1期43-49,共7页Optics & Optoelectronic Technology

基　　金：国家重点研发计划(2019YFB2006700)资助项目。

摘　　要：随着集成电路制造技术的发展,封装尺寸变得更加细密,焊料变形导致的互连短路问题日益突出,针对芯片凸点进行共面性缺陷检测即测量凸点高度的需求更加迫切。为实现这一目的,建立了基于白光三角法的芯片凸点高度测量仿真模型,系统分为光源整形模块,精密狭缝、显微投影系统和显微成像系统。分析了样品移动过程中凸点顶部反射光斑的变化情况,同时对比本系统会聚光线和传统平行光线对于凸点顶部成像光斑的影响,针对上述分析提出适用于凸点高度检测的方法,并使用仿真结果加以证明模型准确性,为搭建实物系统完成真实样品检测任务提供参考依据。With the development of integrated circuit manufacturing technology,the package size has become more compact,and the problem of interconnection short-circuit caused by solder deformation has become more prominent.The need for coplanarity defect detection for chip bumps,the measurement of bump height,is more urgent.To achieve this goal,A simulation model of chip bump height measurement is established based on white light triangulation.The system is divided into a light source shaping module,a precision slit,a microscopic projection system,and a microscopic imaging system.The analysis of the change of the reflected light spot on the top of the bump is focused during the movement of the sample.The influence of the convergent light and traditional parallel light of the system is compared on the imaging light spot on the top of the bump.Based on the above analysis,a method suitable for the detection of the height of the bump is proposed and the simulation results are used.

关 键 词：白光三角法 芯片凸点 高度测量 仿真 

分 类 号：TN405[电子电信—微电子学与固体电子学]