添加剂对HEDP镀铜溶液性能的影响  

Effects of Additive on the Properties of HEDP Copper Plating Solution

作　　者：邱媛[1] 元泉 杨志业[1] 肇梓寒 刘鹏[1] QIU Yuan;YUAN Quan;YANG Zhiye;ZHAO Zihan;LIU Peng(Shenyang Aircraft Corporation,Shenyang 110034,China)

机构地区：[1]沈阳飞机工业(集团)有限公司,辽宁沈阳110034

出　　处：《电镀与精饰》2022年第5期33-38,共6页Plating & Finishing

摘　　要：研究了HEDP镀铜时0.4 g/L添加剂R对镀铜溶液的润湿能力、分散能力、深镀能力的影响规律,并考察了0.4 g/L添加剂溶液在不同金属基体上获得的镀层的外观和结合力。结果表明:加入添加剂前后,溶液的接触角由37.0°降低至24.5°,添加剂的加入使溶液的润湿能力获得明显的改善;溶液中加入0.4 g/L添加剂后分散能力达到80.18%,高于未加添加剂溶液的65.29%,分散能力有所提高;溶液的深镀能力达到100%,150 mm×Φ7 mm的盲孔管件内壁能够全部上镀;利用0.4 g/L添加剂溶液在不锈钢、硅青铜、铝合金以及钛合金上分别镀铜后发现,镀层具有良好的外观质量,热震后镀层未出现鼓包、破裂或脱落现象,镀层具有较高的结合力;铜作为打底层在不锈钢、硅青铜和铝合金上分别镀覆锡、锡铋和银后发现,镀层表面光滑平整,弯折及划格后发现镀层并未出现分层或脱落现象,镀层结合力良好。The influence of 0.4 g/L additive R on the wetting ability,dispersion ability,and deep plating ability of the plating solution during HEDP copper plating was studied,and the surface and binding force of copper coatings obtained by 0.4 g/L additive solution on different metal substrates were investigated.The results showed that the contact angle of the solution decreased from 37.0°to 24.5°after the addition of additives,and the wetting ability of the solution was obviously improved.When 0.4 g/L additive was added into the solution,the dispersing ability reached 80.18%,which was higher than 65.29%of the solution without additive.The deep plating ability of the solution reached 100%,the inner wall of 150 mm×Φ7 mm blind hole pipe could be plated completely.After copper plating on stainless steel,silicon bronze,aluminum alloy and titanium alloy with 0.4 g/L additive solution,it was found that the coating had good appearance quality.After thermal shock,the coating did not bulge,break or fall off,which mean that the coating has a relatively high binding strength.After copper was used as the backing layer,tin,tin bismuth and silver were respectively plated on stainless steel,silicon bronze and aluminum alloy,it was found that the surface of the coating was smooth and flat.After bending and scribing,it was found that there was no delamination or peeling off of the coating,and the adhesion of the coating was good.

关 键 词：HEDP 镀铜 添加剂 溶液 性能 

分 类 号：TQ153.1[化学工程—电化学工业]