Cu/SU-8复合结构的高精度机械研磨  

High Precision Mechanical Grinding of Cu/SU-8 Compound Structures

作　　者：田苗 周欣 陈舒静 张笛 瞿敏妮 毛海平 乌李瑛 Tian Miao;Zhou Xin;Chen Shujing;Zhang Di;Qu Minni;Mao Haiping;Wu Liying(Center for Advanced Electronic Materials and Devices,School of Electronic Information and Electrical Engineering,Shanghai Jiao Tong University,Shanghai 200240,China;DISCO HI-TEC CHINA Co.,Ltd.,Shanghai 200131,China)

机构地区：[1]上海交通大学电子信息与电气工程学院先进电子材料与器件平台,上海200240 [2]迪思科科技(中国)有限公司,上海200131

出　　处：《微纳电子技术》2022年第4期379-384,391,共7页Micronanoelectronic Technology

摘　　要：由于其独特的厚度优势,SU-8经常在微加工领域被用作模具,通过电镀实现金属的大深宽比结构。但是,由于电镀的特殊性,其获得的金属结构表面往往需要进行研磨整平。对在SU-8大深宽比结构中电镀金属后形成的复合结构的研磨进行研究,设计并制备了Cu/SU-8复合结构,并进行了一系列表面磨削实验,分析了复合结构的研磨机理和磨轮的选择依据。结果表明,通过降低磨轮粒度,并采用先树脂结合剂磨轮、后陶瓷结合剂磨轮的研磨序列,可以使Cu和SU-8的粗糙度分别下降到36 nm和34.7 nm,使Cu向SU-8区域的延展大幅减轻,使Cu和SU-8的高度差降低到100 nm。通过Cu/SU-8复合结构的研磨,研究了复合材料表面磨削过程中改善表面状态的方法。研究成果可为提高复合结构的磨削效率和加工精度提供支持和参考。Due to its unique thickness advantage, SU-8 is often used as a mold in the field of micromachining to achieve large aspect ratio structures of metal through electroplating. How-ever, due to the particularity of electroplating, the surface of the obtained metal structure often needs to be ground and polished. After electroplating metal, the grinding of the formed compound structure in the SU-8 large aspect ratio structure was studied. A Cu/SU-8 compound structure was designed and prepared, and a series of surface grinding experiments were conducted to analyze the grinding mechanism of the compound structure and the selection basis of grinding wheels. The results show that by reducing the grit size of the grinding wheel and adopting the grinding sequence of resin bond grinding wheels first and ceramic bond grinding wheels afterwards, the roughnesses of Cu and SU-8 can be reduced to 36 nm and 34.7 nm, respectively. The extension of Cu to the SU-8 area is greatly reduced, and the height difference between Cu and SU-8 is reduced to 100 nm. Through the grinding of Cu/SU-8 compound structure, the method to improve the surface conditions during the surface grinding of compound structures was researched. The research results can provide support and reference for improving the grinding efficiency and machining precision of compound structures.

关 键 词：复合结构 电镀 研磨 SU-8 粗糙度 

分 类 号：TN305.2[电子电信—物理电子学]