脉冲技术在离子镀膜中的应用机理和展望  

Application Mechanism and Prospects of Pulsed Technology in Arc Ion Plating

作　　者：曹时义 代伟[2] 王俊锋 CAO Shiyi;DAI Wei;WANG Junfeng(Guangdong Dtech Technology Co.,Ltd.,Dongguan 523900,China;Guangdong University of Technology,Guangzhou 510006,China)

机构地区：[1]广东鼎泰高科技术股份有限公司,东莞523900 [2]广东工业大学,广州510006

出　　处：《真空科学与技术学报》2022年第4期244-255,共12页Chinese Journal of Vacuum Science and Technology

摘　　要：脉冲电源技术因在等离子体镀膜中表现出增强离化、强附着、高效沉积和涂层光滑致密等特性而日益应用广泛。本文简述了脉冲电源技术在引弧、弧源和基体偏压等镀膜应用,从等离子体产生、传输过程及粒子沉积等全局出发,阐述了脉冲参数与弧斑运动、靶材利用率、离化状态(能量、比例和密度)以及涂层性能等因素间的作用机制,对比分析了脉冲与直流技术在电弧等离子镀膜中的优势和差异点。同时,提出了对现有脉冲技术仍需攻破批量稳定、弧源和偏压源参数匹配以及高能电磁干扰等技术应用难点,为拓展脉冲电源技术更广更深的应用提供较有益的理论依据和工艺参考方向。Pulsed power technologies are widely used in vacuum plasma coating because they provide enhanced ionization,strong adhesion,high-efficiency deposition,and access to smooth and dense films.In this paper,the applications of pulsed power technology in arc ignition,arc source,substrate bias,etc.,are briefly described.From the overall view of plasma generation,transmission process,and particle deposition,the interaction mechanisms between pulsed parameters and arc spot motion,target utilization,ionization state(energy,proportion,and density),and coating performance are analyzed.The advantages and differences of pulsed and DC technology in arc plasma coating are compared and analyzed.Meanwhile,it is proposed that the existing pulsed technology still needs to overcome technical difficulties such as batch stability,parameter matching between arc source and bias source,and especially high-energy electromagnetic interference.It provides a useful theoretical basis and process reference for a broader application of pulsed power technology.

关 键 词：脉冲技术 真空镀膜 脉冲偏压 离化 工艺控制 

分 类 号：TB79[一般工业技术—真空技术]