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作 者:李延民[1] 王振 刘锡山 庄天宇 LI Yan-min;WANG Zhen;LIU Xi-shan;ZHUANG Tian-yu(School of Mechanical Engineering,Zhengzhou University,He'nan Zhengzhou 450001,China)
出 处:《机械设计与制造》2022年第5期205-208,215,共5页Machinery Design & Manufacture
基 金:郑州市协同创新重大专项项目(18XTZX12005)。
摘 要:针对制冷片中半导体颗粒的自动整齐排列问题,根据颗粒之间排列的间距和方向设计整列板上表面的凹槽,让半导体颗粒在整列板上运动并落入凹槽中,从而实现半导体颗粒的自动整齐排列。运用ADAMS软件建立半导体颗粒在整列板上的运动仿真模型,对整列板添加不同的运动振型,运用正交试验方法设计仿真方案,以半导体颗粒完成整列花费的时间为仿真指标,运行仿真并得出不同运动振型下的仿真结果。通过对仿真数据进行对比分析,找出适合半导体颗粒整列的最佳运动振型,为半导体颗粒自动化整列装置的设计提供参考依据。Aiming at the problem of automatic alignment of semiconductor particles in a refrigerating sheet,the grooves on the surface of the entire panel are designed according to the pitch and direction of the arrangement between the particles. The semiconductor particles move on the entire column and fall into the grooves to realize the semicon-ductor particles automatically arranged neatly. Using ADAMS software to establish the motion simulation model of semiconductor particles on the column,adding different motion modes to the whole column and using the orthogonal test method to design the simulation scheme and the semiconductor particles to complete the whole column as the simulation index,running the simulation to obtain the simulation results under different motion modes. By com-paring and analyzing the simulation data,the optimal motion mode suitable for the whole column of semiconductor particles is found which provides a reference for the design of the semiconductor particle automatic arranging device.
分 类 号:TH16[机械工程—机械制造及自动化] TH113.1
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