All-SiC Fiber-Optic Sensor Based on Direct Wafer Bonding for High Temperature Pressure Sensing  

作　　者：Ting LIANG Wangwang LI Cheng LEI Yongwei LI Zhiqiang LI Jijun XIONG 

机构地区：[1]Science and Technology on Electronic Test&Measurement Laboratory,North University of China,Taiyuan 030051,China [2]Department of Physics,Taiyuan Normal University,Jinzhong 030619,China [3]Institute of Computational and Applied Physics,Taiyuan Normal University,Jinzhong 030619,China

出　　处：《Photonic Sensors》2022年第2期130-139,共10页光子传感器（英文版）

基　　金：This work was supported by the National Natural Science Foundation of China(Grant No.51935011);the fund for Shanxi"1331 Project"Key Subject Construction,Shanxi Natural Science Foundation(Grant Nos.201801D121157 and 201801D221203);Scientific and Technological Innovation Programs of Higher Education Institutions in Shanxi(Grant No.1810600108MZ).

摘　　要：This paper presents an all-SiC fiber-optic Fabry-Perot(FP)pressure sensor based on the hydrophilic direct bonding technology for the applications in the harsh environment.The operating principle,fabrication,interface characteristics,and pressure response test of the proposed all-SiC pressure sensor are discussed.The FP cavity is formed by hermetically direct bonding of two-layer SiC wafers,including a thinned SiC diaphragm and a SiC wafer with an etched cavity.White light interference is used for the detection and demodulation of the sensor pressure signals.Experimental results demonstrate the sensing capabilities for the pressure range up to 800 kPa.The all-SiC structure without any intermediate layer can avoid the sensor failure caused by the thermal expansion coefficient mismatch and therefore has a great potential for pressure measurement in high temperature environments.

关 键 词：SIC pressure sensor OPTICAL-FIBER high temperature direct bonding 

分 类 号：TP2[自动化与计算机技术—检测技术与自动化装置]