板间连接器低空洞真空汽相焊接技术  

Research on Low Void Vacuum Vapor Soldering Technology of Printed Circuit Boards Electrical Connectors

作　　者：邱静萍 王文智 李少聪 毛海珂 张绍东 QIU Jingping;WANG Wenzhi;LI Shaocong;MAO Haike;ZHANG Shaodong(Shanghai Aerospace Electronics Co.,Ltd.,Shanghai 201821,China)

机构地区：[1]上海航天电子有限公司,上海201821

出　　处：《电子与封装》2022年第5期17-22,共6页Electronics & Packaging

摘　　要：混装型印制板上板间连接器通孔焊接稳定性和焊点可靠性备受瞩目,焊接工艺的设计方案层出不穷,但在实际生产中能调控焊锡量、改善空洞率、提升焊透率并投入应用的寥寥无几。以板间连接器为研究对象,采用正交试验法系统分析了焊接方式、印制板厚度、预成型焊锡环圈数等工艺参数对焊点质量的影响。通过对板间连接器焊点进行建模仿真、理论计算及金相分析验证,提出了一种可行的真空汽相焊技术与预成型焊锡环相结合的焊接板间连接器工艺方案,结果表明该方案可实现良好的焊接质量、低空洞率和高达100%的焊透率。The pin-through-hole soldering consistency and reliability of the electrical connectors on mixed printed circuit board(PCB)have attracted much attention.Actually,there are endless designs to pursue a defect-free soldering process.However,few schemes can adjust the amount of solder,improve the porosity,enhance the effect of through-hole penetration rate,and put them into application in actual production.Based on PCB electrical connectors,the orthogonal test is utilized to systematically analyze the influence of soldering approaches,PCB thickness,the amount of solder preform rings,and other process parameters on the quality of through-hole solder joints.By means of modeling and simulation,theoretical calculation,and metallographic analysis of through-hole solder joints,proposing a feasibility process of combining vacuum vapor soldering technology and solder preform ring to solder the connectors has been researched in detail.The results reveal that such an approach achieves a superior soldering quality,low porosity,and a through-hole solder joint penetration rate of 100%.

关 键 词：板间连接器 焊接工艺 真空汽相焊 预成型焊锡环 

分 类 号：TG44[金属学及工艺—焊接] TN305.94[电子电信—物理电子学]