复配磷酸盐无氰镀金液中配位导电盐的筛选  

Selection of complexing and conducting salts for cyanide-free gold electroplating in a phosphate-based bath

作　　者：叶仁祥 浦建堂 YE Renxiang;PU Jiantang(Shandong Lulan Environmental Protection Technology Co.,Ltd.,Linyi 276034,China)

机构地区：[1]山东鲁蓝环保科技有限公司,山东临沂276034

出　　处：《电镀与涂饰》2022年第9期628-633,共6页Electroplating & Finishing

摘　　要：以磷酸盐、乙二胺四乙酸二钠、碳酸盐、亚硫酸盐、焦亚硫酸盐、海因衍生物等物质复配成配位导电盐,并探索了它在复配磷酸盐体系无氰镀金工艺中的应用。在复配配位导电盐用量200 g/L、pH 8.5、温度30℃和阴极电流密度1.0 A/dm^(2)的最佳工艺条件下得到的金镀层呈24K金色,结合力和耐蚀性良好,且镀液稳定、均镀能力强。Phosphate,disodium ethylenediaminetetraacetate,carbonate,sulfite,pyrosulfite,hydantoin derivative,and other compounds were selected as complexing and conducting salts for cyanide-free gold electroplating in a phosphate-based bath.The coating prepared with 200 g/L of complexing and conducting salts at temperature 30℃,pH 8.5,and cathodic current density 1.0 A/dm^(2) was in 24K golden color,and had good adhesion and corrosion resistance.The bath was stable and had good throwing power.

关 键 词：无氰镀金 磷酸盐 配位导电盐 膜厚均匀性 附着力 稳定性 

分 类 号：TQ153.18[化学工程—电化学工业]