陶瓷封装外壳镀金层变色原因分析  

Reason analysis on discoloration of gold coating on ceramic package

作　　者：路聪阁[1] 任宇欣 LU Congge;REN Yuxin(The 13th Research Institute of China Electronics Group Corporation,Shijiazhuang 050000,China)

机构地区：[1]中国电子科技集团公司第十三研究所,河北石家庄050000

出　　处：《电镀与涂饰》2022年第9期654-656,共3页Electroplating & Finishing

基　　金：国家重点研发计划项目(2016YFB0400503)。

摘　　要：采用扫描电镜和能谱仪分析了陶瓷封装外壳镀金层变色的原因,发现金层变色是银铜焊料中的银通过焊接处边缘缺陷扩散至金层表面所致。提出了相应的预防措施。The reasons for the discoloration of the gold coating electroplated on ceramic package were analyzed by scanning electron microscopy and energy-dispersive spectroscopy.It was found that the silver element contained in silver-copper soldering flux diffused to the surface of gold coating as some defects exited at the edge of welding parts,finally leading to the discoloration of gold coating.Some countermeasures were presented.

关 键 词：陶瓷封装外壳 镀金层 变色 银迁移 故障处理 

分 类 号：TN305[电子电信—物理电子学]