Osteotomy combined with the trephine technique for invisible implant fracture:A case report  

作　　者：Liang-Wen Chen Min Wang Hai-Bin Xia Dong Chen 

机构地区：[1]Department of Oral Implantology,School and Hospital of Stomatology,Wuhan University,Wuhan 430079,Hubei Province,China

出　　处：《World Journal of Clinical Cases》2022年第16期5479-5486,共8页世界临床病例杂志

摘　　要：BACKGROUND Implant fracture is one of the most serious mechanical complications of dental implants.Conventional treatment necessitates visibility of the apical portion of the fractured implant,whereas for deep and invisible implant fractures,the traditional trephine method has been ineffective.Surgical removal of the marginal bone to expose the fracture surface would be a time-consuming and extensively damaging procedure.Here,we propose a novel technique to address invisible implant fractures.CASE SUMMARY A 50-year-old woman was referred to our department with the chief complaint that her right mandibular implant tooth had fallen out 3 mo earlier.Cone-beam computed tomography examination showed an implant fracture with a fracture surface 5.1 mm below the crestal ridge.The patient was treated with osteotomy combined with the trephine technique to expose the surgical field and remove the implant.The invisible fractured implant was successfully removed,with minimal trauma.A modified Wafer technique-supported guided bone regeneration treatment was then administered to restore the buccal bone wall and preserve the bone mass.Six months later,fine regenerative bone and a wide alveolar crest in the edentulous area were observed,and a new implant was placed.Four months later,restoration was completed using a cemented ceramic prosthesis.Clinical and radiographic examinations 12 mo after loading fulfilled the success criteria.The patient reported no complaints and was satisfied.CONCLUSION Osteotomy combined with the trephine technique can be effectively used to address deep and invisible implant fractures.

关 键 词：Dental implant Invisible implant fracture OSTEOTOMY Explanation trephine Transformed Wafer technique Case report 

分 类 号：R783.6[医药卫生—口腔医学]