时效处理工艺对电解铜箔抗拉强度的影响  

Effect of aging treatment process on tensile strength of electrolytic copper foil

作　　者：付争兵 丁瑜 FU Zheng-bing;DING Yu(College of Chemistry and Materials Science,Hubei Engineering University,Xiaogan,Hubei 432000,China)

机构地区：[1]湖北工程学院化学与材料科学学院,湖北孝感432000

出　　处：《电池》2022年第3期302-304,共3页Battery Bimonthly

摘　　要：抗拉强度影响电解铜箔作为负极集流体的使用效能。对正极电解铜箔进行时效处理,然后进行XRD和SEM分析,并测试铜箔的抗拉强度。时效温度和时间对铜箔的抗拉强度都有影响,当二者分别为40℃和24 h时,处理后铜箔的抗拉强度较未处理铜箔提高了13.4%。时效处理过程中铜晶粒的二次取向生长,是铜箔抗拉强度变化的主要原因。The use efficiency of electrolytic copper foil as anode current collector was affected by its tensile strength.The copper foil peeled from the cathode roller was aged,then analyzed by XRD and SEM,the tensile strength of the copper foil was tested.The aging temperature and time had effects on the tensile strength of copper foil.When they were 40℃and 24 h,respectively,the tensile strength of copper foil after aging was increased by 13.4%compared with that of untreated copper foil.The secondary production of copper grains during aging treatment was the main reason for the change of tensile strength.

关 键 词：铜箔 时效处理 抗拉强度 集流体 铜晶粒 

分 类 号：TM912.9[电气工程—电力电子与电力传动]