化学镀铜沉积层内应力研究  

Study on the internal stress of electroless deposited copper

作　　者：李晓红 魏雯静 邵永存 章晓冬 刘江波 Li Xiaohong;Wei Wenjing;Shao Yongcun;Zhang Xiaodong;Liu Jiangbo

机构地区：[1]广东天承科技股份有限公司,广东广州511300 [2]上海天承化学有限公司,上海201500

出　　处：《印制电路信息》2022年第5期7-13,共7页Printed Circuit Information

摘　　要：文章简要介绍了三种镀层内应力测试方法,并利用螺旋应力仪研究了不同化学镀铜液所得铜沉积层的内应力,分析了常用化学镀铜液添加剂氰化物、联吡啶、2-巯基苯并噻唑(2-MBT)、镍离子等对镀层内应力的影响,以及添加剂在镀液中的含量及沉铜反应温度对沉积层内应力的影响。通过对内应力和铜沉积速率的分析,发现二者存在着一定的关联。This article briefly introduced three methods to measure internal stress of plated metallic coating.By means of spiral stress meter,a series of electroless copper baths were studied to obtain their deposits internal stress,which revealed the influences of several common additives on the electroless deposited copper,including cyanide,dipyridyl,2-MBT and nickel ion.It also studied how the addictive concentration and reaction temperature impact on the internal stress of electroless copper deposits.Finally,certain correlation was disclosed between internal stress and deposition rate in this paper.

关 键 词：化学镀铜 内应力 螺旋应力仪 氰化物 联吡啶 

分 类 号：TN41[电子电信—微电子学与固体电子学]