基于纳米颗粒热效应的飞秒激光高效直写金属铜微结构  

Femtosecond Laser Direct Writing of Copper Microstructures with High Efficiency via Thermal Effect of Nanoparticles

作　　者：崔梦雅 黄婷[1] 肖荣诗[1] Cui Mengya;Huang Ting;Xiao Rongshi(Faculty of Materials and Manufacturing,Beijing University of Technology,Beijing 100124,China)

机构地区：[1]北京工业大学材料与制造学部,北京100124

出　　处：《中国激光》2022年第8期155-165,共11页Chinese Journal of Lasers

基　　金：国家自然科学基金(51975018)。

摘　　要：在Cu(NO_(3))_(2)前驱体溶液中添加硅纳米颗粒,采用飞秒激光在透明基底表面成功直写了导电金属铜微结构。前驱体溶液中的硅颗粒作为吸光粒子吸收激光能量后对溶液进行加热,使Cu^(2+)还原为金属铜并沉积在基底表面。结果表明:当激光光强为5.32×10^(9)~8.51×10^(9)W·cm^(-2)、扫描速度为100~500mm·s^(-1)时,微结构主要由铜、Cu_(2)O及微量硅组成,铜含量及微结构的导电性随着光强的增加或扫描速度的降低而逐渐增加;在光强为5.32×10^(9)W·cm^(-2)、扫描速度为100mm·s^(-1)的条件下,铜微结构的方阻为0.28Ω·sq^(-1),电阻率为4.67×10^(-6)Ω·m。与已有的飞秒激光直写铜微结构的技术相比,这种方法使激光光强降低了2个数量级,直写效率提高了1~3个数量级。Objective The precise conductive Cu micropatterns have been used in a variety of electronic devices.Compared to other traditional fabrication methods,laser direct writing is more efficient and reliable.The femtosecond laser direct writing technique,in particular,is used to construct highly conductive Cu microstructures.Femtosecond laser with ultrashort pulse duration can precisely control the heat input resulting in the reduction of Cu^(2+)in the laser irradiation zone without the damage of substrate.However,the intensity is as high as 10^(11) W·cm^(-2) and the scanning speed is generally lower than 10mm·s^(-1) to achieve the necessary reduction temperature.Si nanoparticles were added to Cu^(2+) solution in this study,acting as photon-absorbing nanoparticles due to their narrow band-gap.The photon-absorbing nanoparticles reduced the volume of the reduction zone by decreasing the penetration depth.The temperature of the reduction zone was rising,resulting in more efficient and less expensive direct writing.As a result,the conductive Cu microstructures were deposited on the substrate with the intensity from 5.32×10^(9)to 8.51×10^(9) W·cm^(-2)and the scanning speed from 100to 500mm·s^(-1).The intensity was two orders of magnitude lower,and the direct writing efficiency was three orders of magnitude higher,compared to previously reported work.The impacts of scanning speed and intensity on the morphology,chemical composition,and conductivity of Cu microstructures were investigated.The lowest sheet resistance was 0.28Ω·sq^(-1) and the lowest electrical resistivity was 4.67×10^(-6)Ω·m at the intensity of 5.32×10^(9) W·cm^(-2)with a scanning speed of 100mm·s^(-1),respectively.Methods The solvent was prepared by mixing 6 mL of ethylene glycol and 3 mL of deionized water.4g of Cu(NO_(3))_(2)·3H_(2)O was added to the solvent with ultrasonication for at least 30 min to thoroughly dissolveCu(NO_(3))_(2)·3H_(2)O .For 2minutes,the liquid was heated to 170℃.The solvent received 100mg of Si nanoparticles.To obta

关 键 词：激光技术 飞秒激光 激光直写技术 吸光粒子 铜微结构 导电性 

分 类 号：TN249[电子电信—物理电子学]