树脂金刚石线在硅晶体切片时的磨损形貌研究  

Study on Wear Morphology of Resin Diamond Wire during Silicon Crystal Slicing

作　　者：邵志松 高伟[1] 延鹏飞 王东雪 Shao Zhisong;Gao Wei;Yan Pengfei;Wang Dongxue(School of Mechanical and Electrical Engineering,Qingdao University of Science and Technology,Qingdao,Shandong 264061,China;不详)

机构地区：[1]青岛科技大学机电工程学院,山东省青岛市264061 [2]青岛高测科技股份有限公司

出　　处：《工具技术》2022年第6期61-64,共4页Tool Engineering

摘　　要：树脂金刚石线切割机理在制造领域得到一定程度的研究,但对其磨损情况和磨损机理方面研究较少。采用自制的树脂金刚石线对硅晶体进行切割试验,用扫描电镜观察树脂金刚石线的磨损形貌,并对磨损机理进行初步分析。研究表明:切割完成后,没有明显的树脂层脱落现象;树脂金刚石线的磨损主要表现为金刚石轻微破碎、开裂及整体破碎、金刚石和树脂层间的离隙和脱落。金刚石的轻微破损主要是在机械应力作用下产生,不存在热磨损的过程;金刚石开裂及整体破碎主要是因为金刚石内部本身存在微小的裂纹以及反复作用的切割力而造成的;树脂层的开裂是造成树脂层和金刚石产生离隙的主要原因,产生离隙的金刚石在切割力作用下发生脱落现象。根据树脂金刚石线的磨损形貌及机理分析,应选择内部裂纹少的金刚石,并尽量提高树脂层的强度及硬度。Resin diamond wire has a certain degree of research in the manufacturing field and cutting mechanism, but there is less research in the wear condition and wear mechanism.In this study, a self-made resin diamond wire is used to cut the silicon crystal, and the wear morphology of the resin diamond wire is observed by scanning electron microscope, and the wear mechanism is preliminary analyzed.Research indicates that there is no obvious resin layer peeling after cutting.The abrasion of resin diamond wire is mainly manifested by the slight breakage, cracking and overall fragmentation of diamond, the clearance and shedding between diamond and resin layer.The slight damage of diamond is mainly caused by mechanical stress, and there is no thermal wear process.Diamond cracking and overall fragmentation are mainly caused by the existence of tiny cracks inside the diamond and repeated cutting forces.The cracking of the resin layer is the main cause of the gap between the resin layer and the diamond.The diamond with clearance falls off under the action of the cutting force.According to the analysis of the wear morphology and mechanism of the resin diamond wire, diamond with few internal cracks should be selected, and the strength and hardness of the resin layer should be improved as much as possible.

关 键 词：树脂金刚石线 硅片 金刚石工具 磨损机理 

分 类 号：TG48[金属学及工艺—焊接] TH117.1[机械工程—机械设计及理论]