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作 者:罗俊洋 张战刚[1,2] 雷志锋 陈资文[1,2,3] 彭超 岳少忠 张鸿 钟向丽 孙常皓 黄奕铭 何玉娟 黄云 LUO Junyang;ZHANG Zhangang;LEI Zhifeng;CHEN Ziwen;PENG Chao;YUE Shaozhong;ZHANG Hong;ZHONG Xiangli;SUN Changhao;HUANG Yiming;HE Yujian;HUANG Yun(CEPREI,Guangzhou 511370,China;Science and Technology on Reliability Physics and Application of Electronic Component Laboratory,Guangzhou 511370,China;School of Materials Science and Engineering,Xiangtan University,Xiangtan 411105,China)
机构地区:[1]工业和信息化部电子第五研究所,广东广州511370 [2]电子元器件可靠性物理及其应用技术重点实验室,广东广州511370 [3]湘潭大学材料科学与工程学院,湖南湘潭411105
出 处:《电子产品可靠性与环境试验》2022年第3期37-41,共5页Electronic Product Reliability and Environmental Testing
基 金:国家自然科学基金项目(12075065);广东省省级科技计划项目(2017B090921001)资助。
摘 要:首先,介绍了3种关键的电子材料超低本底α粒子发射测试技术,包括α粒子来源甄别、宇宙射线信号识别和氡气本底来源判别技术;然后,通过进一步地开展试验研究,发现锡铅合金焊料的表面α粒子发射率远高于锡银铜合金焊料,发射能谱分析表明二者发射的α粒子均来自材料自身的^(210)Po核素,而经提纯处理后的合金焊料的表面α粒子发射率显著地下降。研究结果对高可靠性、大规模电子系统α粒子软错误测试和评价,以及提升产品可靠性具有重要的意义。Firstly,three key technologies for testing ultra-low backgroundαparticle emission of electronic materials are introduced,includingαparticle source identification,cosmic ray signal identification and radon background source identification technology.Then,through further experimental research,it is found that the surfaceαparticle emissivity of tin-lead alloy solder is much higher than that of tin-silver-copper alloy solder.The emission spectrum analysis shows that theαparticles emitted by the two materials are all from the^(210)Po nuclide of the material itself,while the surfaceαparticle emissivity of the purified alloy solder decreases significantly.The research results are of great significance for the testing and evaluation ofαparticle soft errors in hign-reliability and large-scale electronic systems,as well as the improvement of product reliability.
分 类 号:TB114.37[理学—概率论与数理统计]
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