非金属材料化学镀铜研究进展  

Research progress of electroless copper plating on nonmetals

作　　者：鄢豪 管英柱 YAN Hao;GUAN Yingzhu(School of Petroleum Engineering,Yangtze University,Wuhan 430100,China)

机构地区：[1]长江大学石油工程学院,湖北武汉430100

出　　处：《电镀与涂饰》2022年第11期791-796,共6页Electroplating & Finishing

摘　　要：介绍了化学镀铜常用的主盐、配位剂、还原剂及添加剂。综述了碳纤维、碳纳米管、Al_(2)O_(3)陶瓷和SiC颗粒化学镀铜的研究进展,指出了非金属化学镀铜存在的问题,并展望了该领域未来的研究方向。The main salts,complexing agents,reductants,and additives often used in electroless copper plating were introduced.The research progress of electroless copper plating on several kinds of nonmetals such as carbon fiber,carbon nanotube,Al_(2)O_(3)-based ceramic,and SiC particle was reviewed.The future research direction of electroless copper plating on nonmetals was proposed.

关 键 词：非金属 化学镀铜 镀液配方 综述 

分 类 号：TQ153.14[化学工程—电化学工业]