基于聚噻吩的金属结晶核复合物薄膜制备及其电镀应用  

Preparation of polythiophene-based metal crystal nucleus composite film and its application in electroplating

作　　者：李玖娟 周国云 何为 洪延 张怀武[2] 王翀 马朝英 艾克华 张仁军 LI Jiujuan;ZHOU Guoyun;HE Wei;HONG Yan;ZHANG Huaiwu;WANG Chong;MA Chaoying;AI Kehua;ZHANG Renjun(School of Materials and Energy,University of Electronic Science and Technology,Chengdu 610054,China;School of Electronic Science and Engineering,University of Electronic Science and Technology,Chengdu 610054,China;Sichuan Huaxingyu Electronic Technology Co.,Ltd.,Deyang 618412,China;Sichuan Intronics Electronic Technology Co.,Ltd.,Suining 629000,China)

机构地区：[1]电子科技大学材料与能源学院,四川成都610054 [2]电子科技大学电子科学与工程学院,四川成都610054 [3]四川省华兴宇电子科技有限公司,四川德阳618412 [4]四川英创力电子科技股份有限公司,四川遂宁629000

出　　处：《电镀与涂饰》2022年第11期797-803,共7页Electroplating & Finishing

基　　金：四川省科技计划项目(2019YFN0161);四川省科技计划项目(2021ZHCG0002)。

摘　　要：采用化学氧化方法聚合聚噻吩(PT)的同时引入铜和银两种不同形貌的结晶核,形成3种复合物薄膜,分别为含铜的聚噻吩薄膜(Cu-PT)、含银的聚噻吩薄膜(Ag-PT)以及含铜和银的聚噻吩薄膜(Cu/Ag-PT)。这3种薄膜不仅导电性能优于PT,而且在相同电镀条件下对玻璃纤维环氧树脂FR-4的上铜速率均高于PT。表面电阻为0.88 kΩ的Cu-PT复合物薄膜的上铜速率最大,达到6.33 mm/min。Copper and silver crystalline nuclei with different morphologies were incorporated simultaneously into the polythiophene(PT)which was polymerized by chemical oxidation,forming three kinds of metal-PT composite films,namely Cu-PT,Ag-PT,and Cu/Ag-PT.These three composite films had better electrical conductivity than PT on fiberglass-reinforced epoxy laminate(FR-4),and the copper electrodeposition rate of on them were higher than that on PT under the same electroplating conditions.The Cu-PT with a surface resistance of 0.88 kΩhad the highest copper electrodeposition rate,which reached 6.33 mm/min.

关 键 词：聚噻吩 化学氧化 铜 银 结晶核 复合物膜 玻璃纤维环氧树脂 直接电镀 

分 类 号：TQ153.2[化学工程—电化学工业]