激光冷分离工艺技术基础研究  

Essential Study on Process Technology of Laser Cold Split

作　　者：李斌[1] 高小虎[1] 邢旻 LI Bin;GAO Xiaohu;XING Min(The 45^(th) Research Institute of CETC,Beijing 100176,China)

机构地区：[1]中国电子科技集团公司第四十五研究所,北京100176

出　　处：《电子工业专用设备》2022年第1期1-3,19,共4页Equipment for Electronic Products Manufacturing

摘　　要：从SiC晶棒切割工艺需求与技术特点出发,对比分析了激光冷分离技术的应用优势,详细介绍了激光冷分离技术研制过程中的关键技术和难点技术,最后对该技术未来发展趋势进行了展望。Based on the requirements and technical characteristics of SiC ingot cutting process,the application advantages of laser cold split technology are compared and analyzed.The key technologies and the difficult technologies in the development of laser cold split technology are introduced in detail.Finally,the future development trend of this technology is prospected.

关 键 词：激光 冷分离 晶棒 晶圆 

分 类 号：TN305.1[电子电信—物理电子学]