电镀技术在大马士革工艺中的应用研究  

Study on Application of Electroplating Technology to Damascene Process

作　　者：林煦呐 刘福强 刘永进[1] 刘一鸣 LIN Xuna;LIU Fuqiang;LIU Yongjin;LIU Yiming(The 45^(th) Research Institute of CETC,Beijing 100176,China)

机构地区：[1]中国电子科技集团公司第四十五研究所,北京100176

出　　处：《电子工业专用设备》2022年第1期20-24,共5页Equipment for Electronic Products Manufacturing

摘　　要：电镀是一种良好的实现金属沉积的电化学工艺方法。为探索电镀技术在大马士革工艺中的应用,先介绍了电镀的基本理论,然后阐述了双大马士革的工艺流程,继而从电镀液和脉冲电镀方面分析了电镀对大马士革工艺的影响。结果表明镀液中的Cl-对电镀有催化作用,脉冲电镀比直流电镀所需的时间短,电流密度对镀层的生长方式影响不大,脉冲时间对填充速率有重要影响。最后提出,应该从电镀设备、电镀液、工艺参数各方面进行研发,从而改善电镀效果,促进集成电路产业的快速发展。Electroplate can achieve metal deposition,it is an excellent electrochemistry process.To discuss the application of electroplate and damascene process,the basic theory of electroplating was introduced firstly.Then dual damascene process flow was described.The influence of plating solution and pulse plating on damascene process was analyzed.The result showed Cl-can accelerate the plating speed,and pulse plating is faster than common plating.Current density of pulse plating has little effect on the way of growth for plating metal,while pulse time has an important effect on deposition speed.At last,it is pointed that plating equipment,plating solution and plating process should be researched,so as to improve the plating effect and promote the rapid development of Integrated Circuit(IC)industry.

关 键 词：集成电路 铜电镀 大马士革工艺 

分 类 号：TQ153[化学工程—电化学工业]