一种无源真空吸附装置的研究  

Study on Passive Vacuum Suction Device

作　　者：齐芊枫 李进春 张德峰 QI Qianfeng;LI Jinchun;ZHANG Defeng(Shanghai Micro Electronics Equipment(Group)Co.,Ltd.,Shanghai 201203,China)

机构地区：[1]上海微电子装备(集团)股份有限公司,上海201203

出　　处：《电子工业专用设备》2022年第1期57-63,共7页Equipment for Electronic Products Manufacturing

摘　　要：为消除真空管路对高精密工件台的干扰,提出并开发了一种无气源、无管路干扰的真空吸附装置,采用与吸盘结构集成的机械驱动装置在常压环境中自动产生真空源,直接实现吸盘吸附硅片的功能,通过对该装置进行试验分析,结果表明,在60 s内可保持吸盘-40~-50 kPa的真空压力,可满足硅片在曝光过程中的吸附要求。In order to eliminate the interference of vacuum pipeline on precision wafer stage,a vacuum suction device without air source and pipeline is proposed and developed.The mechanical device integrated with chuck can generate vacuum source in the normal environment,and makes the chuck to realize clamping the wafers.Through test of the device,the device can produce and maintain vacuum of-40~-50 k Pa in 60 seconds.It can meet the clamping requirements of wafers in the exposure process.

关 键 词：工件台 无源真空 吸附装置 

分 类 号：TN305[电子电信—物理电子学]