集成电路湿法工艺与湿法设备制造技术研究  

Research on Wet Process and Wet Bench Manufacturing Technology of Integrated Circuit

作　　者：宋文超[1] 李家明 贾祥晨 刘广杰 王洪建[1] SONG Wenchao;LI Jiaming;JIA Xiangchen;LIU Guangjie;WANG Hongjian(The 45^(th) Research Institute of CETC,Beijing 100176,China)

机构地区：[1]中国电子科技集团公司第四十五研究所,北京100176

出　　处：《电子工业专用设备》2022年第2期30-35,65,共7页Equipment for Electronic Products Manufacturing

摘　　要：简述了集成电路制造中的湿法工艺,重点介绍了栅氧清洗、RCA清洗、去胶、氮化硅去除、氧化硅腐蚀等湿法工艺,并对槽式湿法设备的关键制造技术进行了讲解。This paper briefly describes the wet process in Integrated Circuit(IC)manufacturing,focuses on the wet processes such as pre-gate clean,RCA clean,PR strip,silicon nitride removal and silicon oxide etch,and explains the key manufacturing technologies of wet bench.

关 键 词：集成电路 湿法工艺 湿法设备 栅氧清洗 湿法去胶 氮化硅腐蚀 

分 类 号：TN405[电子电信—微电子学与固体电子学]