机载电子设备温循寿命试验方法探讨  

Discussion on Experimental Method of Temperature Cycle Life for Airborne Electronic Equipment

作　　者：醋强一[1] 成鑫 畅凡 焦远翔 Cu Qiangyi;Cheng Xin;Chang Fan;Jiao Yuanxiang(AVIC Aeronautical Computing Technique Research Institute,Xi'an 710065,China;Northwestern Polytechnical University,Xi’an 710072,China)

机构地区：[1]航空工业西安航空计算技术研究所,陕西西安710065 [2]西北工业大学,陕西西安710072

出　　处：《航空科学技术》2022年第6期86-89,共4页Aeronautical Science & Technology

基　　金：国家科技重大专项(2017-V-0014-0066)。

摘　　要：针对机载电子设备元器件焊点热疲劳失效问题,对比了行业内不同标准对电子设备温循试验的要求,探讨了传统美军标环境鉴定试验条件不能充分验证元器件焊点热疲劳寿命的现状,提出了ECSS-Q-ST-70-38C标准适用于板级高可靠温循寿命验证试验,以及VITA47.1标准适用于模块级和整机级电子设备温循寿命验证。采用VITA47.1标准对机载计算机模块设计温循寿命试验,准确定位了模块温循寿命薄弱元器件,证明了CBGA封装器件低铅焊点比高铅焊点更容易先发生热疲劳失效的问题。Aiming at the thermal fatigue failure of airborne electronic equipment, the requirements of temperature cycle test for electronic equipment of different standards in the industry are compared, the present United States environmental identification test conditions of airborne electronic equipment are discussed, and it is found that the thermal fatigue life of component solder joints could not be fully verified. The ECSS-Q-ST-70-38C standard is proposed to be suitable for plate level high reliable temperature cycle life verification test, VITA47.1 standard is proposed to be suitable for module level and whole machine level temperature cycle life verification of electronic equipment. VITA47.1 standard is used to design the temperature cycle life test of airborne computer module, and the weak components of the module temperature cycle life are accurately located. It is proved that the low lead solder joints of CBGA packaging devices are more likely to have thermal fatigue failure first than the high lead solder joints.

关 键 词：机载电子设备 元器件焊点 热疲劳寿命 温循试验 

分 类 号：TH123[机械工程—机械设计及理论]