Sb、Bi、Ni元素对Sn基无铅焊点电迁移可靠性的影响  

Effects of Sb,Bi and Ni elements on the electromigration reliability of Sn-based lead-free solder joints

作　　者：任杰 王乙舒 周炜 王晓露 郭福[1] REN Jie;WANG Yishu;ZHOU Wei;WANG Xiaolu;GUO Fu(Key Laboratory of Advanced Functional Materials,Education Ministry of China,Beijing University of Technology,Beijing 100124,China)

机构地区：[1]北京工业大学新型功能材料教育部重点实验室,北京100124

出　　处：《电子元件与材料》2022年第6期641-647,654,共8页Electronic Components And Materials

基　　金：国家自然科学基金(52001013);北京市科委项目(Z191100002019005)。

摘　　要：智能汽车的高集成化发展,使得组装焊点尺寸减小,对焊点抗电迁移服役可靠性的要求提高。目前用于汽车电子的三元系焊料SnAgCu无法满足日益严苛的服役环境,而多元合金化焊料是最有潜力的解决方案之一。通过差示扫描量热法、润湿性实验以及电子背散射衍射仪、扫描电子显微镜、能谱仪等表征手段,系统研究了添加Ni、Sb、Bi元素对SnAgCu焊料的焊接性能和电迁移可靠性的影响。结果表明:添加Ni、Sb、Bi元素降低了SnAgCu焊料的熔点和过冷度,改善了焊料的润湿性。在高电流密度载荷作用下,这些元素的引入可以有效地缓解焊点电迁移行为,进而提高焊点的服役可靠性。With the development of highly-integrated smart cars,the size of assembled solder joints is continuously decreasing,which require higher service reliability of solder joints against electromigration.The current ternary SnAgCu solder,used in automotive electronics,cannot meet the increasingly harsh service requirements.Multi-alloyed solder is one of the most promising solutions to this issue.The effects of Ni,Sb and Bi addition to SnAgCu solders were systematically investigated on the soldering properties and electromigration reliability by using techniques such as differential scanning calorimetry,wettability experiments,and many other characterization methods such as electron backscatter diffraction,scanning electron microscopy,energy spectrometry.The results show that addition of Ni,Sb and Bi can decrease the melting point and subcooling temperatures of the multi-alloyed solders and improve their wettability.Under a high current density,the electromigration behavior of the solder joints can be effectively mitigated by introducing these elements,which can in turn improve the service reliability of the solder joints.

关 键 词：电迁移 可靠性 多元合金焊料 IMC 

分 类 号：TN406[电子电信—微电子学与固体电子学]