FIB-SEM双束系统在PCB及IC载板缺陷检测中的应用  

Application of FIB-SEM Dual Beam System in Defect Detection of PCB and IC-substrate

作　　者：霍发燕 HUO Fayan(Shanghai Meadville Science&Technology Co.,Ltd.,Shanghai 201613,China)

机构地区：[1]上海美维科技有限公司,上海201613

出　　处：《电子工艺技术》2022年第4期238-240,共3页Electronics Process Technology

摘　　要：FIB-SEM(Focused Ion Beam-Scanning Electron Microscope)双束系统是集聚焦离子束和扫描电子显微镜与一体的系统,其最大的优势是可以实现离子束切割或微加工的同时用电子束实时观察的功能。主要介绍FIB-SEM双束系统在PCB及IC载板缺陷检测中的常见应用,如盲孔孔底分析、杂物失效分析和晶体结构分析。FIB-SEM dual beam system is a system integrating focused ion beam and scanning electron microscope.Its biggest advantage is that it can realize the function of real-time observation with electron beam while ion beam cutting or micromachining.The common application of FIB-SEM in defect detection of PCB and IC-substrate is mainly introduced,such as blind hole bottom analysis,debris failure analysis,crystal structure analysis.

关 键 词：FIB-SEM双束系统 PCB IC载板 盲孔孔底分析 杂物失效分析 晶体结构分析 

分 类 号：TN606[电子电信—电路与系统]