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作 者:曾福林[1] 安维[1] 李冀星 ZENG Fulin;AN Wei;LI Jixing(Zhongxing Telecommunication Equipment Corporation,Shenzhen 518057,China)
出 处:《电子工艺技术》2022年第4期245-248,共4页Electronics Process Technology
摘 要:介质耐压性能对于电源产品PCB至关重要,直接决定了电源产品的长期可靠性。长期以来对于PCB层间耐压设计要求不清晰,导致企业经常发生耐压起火的安全事故,给企业带来巨大的损失。重点研究了基板的耐压和基板压合后耐压的差异,明确了每mil(1 mil=25.4μm)介质厚度可承受的耐压值,对电源产品PCB的设计选型具有重要的指导意义。Dielectric withstanding voltage is crucial for the PCB of power supply which directly determines the long-term reliability of the power products.For a long time,the design requirements for the withstand voltage of the PCB layer are not clear,resulting in the frequent occurrence of safety accidents such as fire and other accidents,which bring huge losses to the enterprises.The Dielectric withstanding voltage difference between CCL and Laminate is mainly studied,and the dielectric thickness withstand voltage per mil is determined.This is of great guiding significance in power supply design and selection of PCB.
分 类 号:TN606[电子电信—电路与系统]
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