基于JMat Pro的Sn-In-Ag/Bi系低温无铅钎料成分性能设计  

Composition performance design of Sn-In-Ag/Bi series low-temperature lead-free solder based on Jmatpro software

作　　者：焦华 白嘉瑜 张建勋[3] 赵康[1,2] JIAO Hua;BAI Jiayu;ZHANG Jianxun;ZHAO Kang(School of Materials Science and Engineering,Xi’an University of Technology,Xi’an 710048,China;Shaanxi Province Key Laboratory of Corrosion and Protection,Xi’an University of Technology,Xi’an 710048,China;State Key Laboratory for Mechanical Behavior of Material,Xi’an Jiaotong University,Xi’an 710049,China)

机构地区：[1]西安理工大学材料科学与工程学院,西安710048 [2]西安理工大学陕西省腐蚀与防护重点实验室,西安710048 [3]西安交通大学金属强度国家重点实验室,西安710049

出　　处：《粉末冶金材料科学与工程》2022年第3期267-275,共9页Materials Science and Engineering of Powder Metallurgy

基　　金：国家自然科学基金资助项目(51875442);陕西省自然科学基金资助项目(2020JQ-626)。

摘　　要：针对Sn-In系低温无铅钎料存在生产成本高、力学性能偏低的问题,基于Sn-In合金相图选择低熔点的Sn-In系钎料合金,进行组分优化来改善热物性能、力学性能、降低成本的研究。在保持Sn75不变的情况下,通过添加Ag和Bi元素,形成不同组分比例的Sn-In-Ag/Bi的低温无铅钎料。采用材料相图与热力学模拟软件JMatPro中的锡合金模块对低温钎料组分进行模拟计算,获得不同组分的无铅钎料的相组成、热物性能和力学性能。同时,研究温度和合金含量对熔点、熔化区间、热物性能和力学性能的影响规律。模拟结果表明,Sn-In-Ag和Sn-In-Ag-Bi系两类低温无铅钎料的优化组分分别为Sn75Ag3In22和Sn75In17Ag3Bi5。In order to solve the problems of high production cost and low mechanical properties of Sn-In lead-free solder,the low melting point Sn-In solder alloy was selected due to the phase diagram of Sn-In alloy. The composition optimization of Sn-In solder alloy was carried out to improve the thermal properties, mechanical properties and reduce cost. The low temperature lead free solder of Sn-In-Ag/Bi with different composition ratios can be formed by adding Ag and Bi elements at Sn75. The low temperature solder composition was simulated and calculated by the material phase diagram and thermodynamic simulation software of JMatPro. The Sn alloy module was selected in the software. The phase composition, thermal properties, and mechanical properties of the lead-free solder with different composition changes can be obtained. Meanwhile, the effects of temperature and alloy content on melting point, melting range,thermal properties and mechanical properties were studied. The simulation results show that two types of low-temperature lead-free solders of Sn-In-Ag and Sn-In-Ag-Bi series have the optimized compositions of Sn75Ag3In22and Sn75In17Ag3Bi5, respectively.

关 键 词：Sn-In 无铅钎料 JMatPro 相图 热物性能 

分 类 号：TG146.14[一般工业技术—材料科学与工程]