印制电路板表面贴装盘扇出的高速信号特性研究  

Research on high speed signal characteristics of fan-out in PCB SMT footprint

作　　者：屈峰成 Qu Fengcheng(Shen Zhen Xdeen Precision Industry Technology Co,Ltd Shen Zhen)

机构地区：[1]深圳市西点精工技术有限公司,广东深圳518000

出　　处：《印制电路信息》2022年第7期6-10,共5页Printed Circuit Information

摘　　要：各式各样的表面贴片器件应用在高速印制电路板中,由于表面贴装相邻的焊盘间距越来越小,这使得从表面贴装中的扇出信号直接成为影响整个数字信号链路的重要组成部分。文章以实际0.8 mm间距QSFP高速连接器的表面贴装为实例,运用电磁仿真软件CST对多层印制板表面贴装与差分信号扇出建模仿真,并以相邻差分信号间的近端串扰和远端串扰性能优劣为指标,分析高速信号在表面贴装中不同的扇出所带来的影响。文章的内容对高速PCB表面贴片封装的布局布线有一定的工程价值。A variety of SMT devices are used in high-speed PCB.Because the distance between adjacent pads of SMT footprint is getting smaller and smaller,the fan-out signal from SMT footprint directly becomes an important part of the whole digital signal link.This paper takes the actual 0.8 mm spacing QSFP high-speed connector's SMT footprint as an example,uses the electromagnetic simulation software CST to model and simulate the SMT footprint and differential signal fan-out on multi-layer PCB,and analyzes the impact of different fan-out of high-speed signal routing in SMT footprint by the performance of near-end crosstalk and far-end crosstalk between adjacent differential signals.This paper has a certain engineering value for the layout and drawing of high-speed PCB SMT footprint.

关 键 词：表面贴装盘 差分信号 扇出 近端串扰 远端串扰 

分 类 号：TN41[电子电信—微电子学与固体电子学]