HDI板跨层孔孔内无铜的失效机理探究  

Analysis on the failure mechanism of skip via void of HDI PCB

作　　者：李仕武 王景贵 谢明运 Li Shiwu;Wang Jinggui;Xie Mingyun(Guangzhou Delton Technology Inc.,Guangzhou 510730,China)

机构地区：[1]广州广合科技股份有限公司,广东广州510730

出　　处：《印制电路信息》2022年第7期41-44,共4页Printed Circuit Information

摘　　要：在5G通讯大背景下,对PCB提出了越来越高的布线和信号要求,跨层孔设计已广泛应用在Whitley平台的服务器板上。文章针对跨层孔孔内无铜问题进行分析,发现是沉铜生产过程中盲孔内溶液交换不良产生,通过加大流量与提高药水浓度可促进盲孔内外溶液交换,有效解决了此类问题。Based on the higher wiring and signal requirements,skip via design has been applied to the server board of Whitley platform.However,there is via copper void in skip via.By analyzing this problem,it is found that the poor solution exchange in blind holes occurs during PTH process.Increasing the flow rate and the solution concentration can promote the solution exchange inside and outside the blind holes,which can effectively solve this kind of problem.

关 键 词：高密度互连板 跨层孔 孔内无铜 

分 类 号：TN41[电子电信—微电子学与固体电子学]