引线框架不同镀银方式对塑料封装产品可靠性的影响  

Analysis on the influence of no silver plating on the frame copper surface on the reliability of plastic packaging products

作　　者：郭昌宏 崔卫兵[1] 张进兵[1] 张丹 张易勒 GUO Chang-hong;CUI Wei-bing;ZHANG Jin-bing;ZHANG Dan;ZHANG Yi-le(TianshuiHuaTian Technology Co.Ltd.)

机构地区：[1]天水华天科技股份有限公司

出　　处：《中国集成电路》2022年第7期65-69,共5页China lntegrated Circuit

摘　　要：本文研究了引线框架在不同温度、不同时间对框架镀银表面与裸铜表面氧化的具体表现,通过对比框架分层情况,分析了铜框架表面不镀银和镀银对可靠性的影响。试验结果表明框架铜表面不镀银对提高集成电路封装产品的可靠性有显著的提升作用。In this paper,the oxidation performance of lead frame on silver plated surface and bare copper surface at different temperatures and different times is studied.By comparing the stratification of the frame,the influence of no silver plating and silver plating on the reliability of copper frame is analyzed.The results show that the absence of silver plating on the frame copper surface has a significant effect on the improvement of IC packaging products.

关 键 词：引线框架 封装 可靠性 

分 类 号：TN405[电子电信—微电子学与固体电子学]