碳化硅骨架增强环氧树脂复合材料的制备及其导热性能  

Preparation and Thermal Conductivity of Silicon Carbide Skeleton Reinforced Epoxy Composites

作　　者：刘曼姝 LIU Man-shu(State Key Laboratory of Marine Resources Utilization in the South China Sea,College of Materials Science and Engineering,Hainan University,Haikou 570228,China)

机构地区：[1]海南大学材料科学与工程学院,南海海洋资源利用国家重点实验室,海南海口570228

出　　处：《塑料科技》2022年第5期62-66,共5页Plastics Science and Technology

摘　　要：以晶硅切割废砂浆(CSW)为原料,通过冰模板法结合原位反应烧结获得三维碳化硅骨架,经真空浸渗法制备环氧树脂/碳化硅(EP/SiC)复合材料。结果表明:反应温度为1 500℃时,获得反应最完全的SiC骨架。随着SiC含量的增加,复合材料的热导率逐渐升高。当SiC质量分数为40%,复合材料的热导率为1.126 W/(m·K),相比纯EP提高563%,且复合材料导热系数的增强率为11.58%。随着SiC含量的增加,复合材料的弯曲强度有所提高。利用恒温加热平台,对EP/SiC在不同温度下的热导率进行研究,EP/SiC基板相比纯EP基板呈现更优异的散热效果。Using crystalline silicon cut waste mortar(CSW) as raw material, the three-dimensional silicon carbide skeleton was obtained by ice template method combined with in-situ reaction sintering. The epoxy resin/silicon carbide(EP/SiC) composite was prepared by vacuum infiltration. The results show that the most complete SiC skeleton can be obtained when the reaction temperature is 1 500 ℃. With the increasing of SiC content in EP matrix, the thermal conductivity of the composites also increase. When the SiC mass fraction is 40%, the thermal conductivity of the composite is 1.126 W/(m·K), which is 563% higher than that of the pure EP, and the thermal conductivity enhancement rate of the composite is 11.58%. The bending strength of the composites increase with the increasing of SiC loading. The thermal conductivity of EP/SiC at different temperatures was studied using a constant temperature heating platform. The EP/SiC substrate showe better heat dissipation effect than the pure EP substrate.

关 键 词：环氧树脂 碳化硅 热导率 晶硅切割废砂浆 

分 类 号：TB332[一般工业技术—材料科学与工程]