军用非密封陶瓷倒装焊器件质量控制研究  

Research on Quality Control of Military Unsealed Ceramic Flip Chip

作　　者：滕丽[1] 罗璞[1] Teng Li;Luo Pu(China Electronics Technology Corporation No.24th Research Institute,Chongqing 400060)

机构地区：[1]中国电子科技集团公司第二十四研究所,重庆400060

出　　处：《电子质量》2022年第7期70-74,共5页Electronics Quality

摘　　要：介绍了非密封陶瓷倒装焊器件结构以及国军标的现状,分析了国外相关标准及质量保证要求。着重对MIL-PRF-38535L中的非密封陶瓷基体器件"Y"级筛选、鉴定考核要求中的各分组检验进行分析了研究,从而解决目前国内没有针对此类产品可执行的通用标准有一定的指导与参考意义。The structure of unsealed ceramic flip chip and the current situation of national military standards are introduced, and the relevant foreign standards and quality assurance requirements are analyzed. The "Y" level screening, identification and assessment requirements for unsealed ceramic matrix devices MIL-PRF-38535L are emphatical y analyzed and studied, so as to solve the current lack of executable general standards for such products in China, which has certain guiding and reference significance.

关 键 词：非密封 倒装焊 质量保证要求 

分 类 号：TN405[电子电信—微电子学与固体电子学]