一种印制电路板功率元件散热结构的设计  

Design of a Heat Dissipation Structure for Power Components on the Printed Circuit Board

作　　者：白思春 褚全红 杨薇 杨俊恩 孟庆涛 BAI Sichun;ZHU Quanhong;YANG Wei;YANG Jun′en;MENG Qingtao(China North Engine Research Institute(Tianjin),Tianjin 300400,China)

机构地区：[1]中国北方发动机研究所(天津),天津300400

出　　处：《仪表技术》2022年第3期1-3,34,共4页Instrumentation Technology

摘　　要：介绍一种印制电路板功率元件散热结构,对焊接面、散热安装面的焊盘、过孔进行优化设计,以表面焊接的方式将功率管焊接到印制电路板上。热量除了从印制电路板焊接面的单层焊盘上散发之外,还可通过印制电路板上的过孔传递到背面的敷铜层及焊盘上,再经过导热硅脂传递到仪器壳体的散热台上。该方案在适应印制电路板的功能区布局要求的同时,能够保证仪器的整体散热要求。A heat dissipation structure of power components on the printed circuit board is introduced. The welding surface, pad and via hole of heat dissipation installation surface are optimized. The power tube is welded to the printed circuit board by the surface welding method. In addition to the heat dissipation of the single-layer pad on the welding surface on the printed circuit board, the heat is transferred to the copper coating and pad on the back through the via hole on the printed circuit board, and then transferred to the heat dissipation table of the instrument shell through the heat conductive silicone grease. The scheme can meet the layout requirements of the functional area of the printed circuit board and ensure the overall heat dissipation requirements of the instrument.

关 键 词：印制电路板 功率元件 散热 焊盘 过孔 

分 类 号：TH70[机械工程—仪器科学与技术]