5,5-二甲基乙内酰脲在化学镀铜中的作用  

Effects of 5,5-Dimethylhydantoin on Electroless Copper Plating

作　　者：郑安妮 金磊 杨家强 王赵云 李威青 杨防祖[1] 詹东平[1] 田中群[1] ZHENG Anni;JIN Lei;YANG Jiaqiang;WANG Zhaoyun;LI Weiqing;YANG Fangzu;ZHAN Dongping;TIAN Zhongqun(College of Chemistry and Chemical Engineering,State Key Laboratory of Physical Chemistry of Solid Surface,Xiamen University,Xiamen 361005,China)

机构地区：[1]厦门大学化学化工学院,固体表面物理化学国家重点实验室,厦门361005

出　　处：《高等学校化学学报》2022年第8期232-236,共5页Chemical Journal of Chinese Universities

基　　金：国家自然科学基金(批准号:22132003,21972118,21827802)资助。

摘　　要：在以酒石酸钾钠和乙二胺四乙酸二钠为双配位剂、甲醛为还原剂的化学镀铜液中,研究了5,5-二甲基乙内酰脲(DMH)在化学镀铜中的作用.化学镀铜实验结果表明,DMH提高了镀液的稳定性;扫描电子显微镜(SEM)结果表明,DMH使镀层颗粒尺寸减小,镀层光亮致密;紫外-可见光谱结果表明,DMH在镀液中与Cu(II)不发生强配位作用;线性伏安扫描结果表明,DMH在化学镀铜过程中能抑制Cu~+的产生或促进Cu~+快速还原,降低甲醛的氧化速率;X射线衍射(XRD)结果表明,在含和不含DMH化学镀铜液中,得到的铜镀层均呈现面心立方混晶结构的特征,且未出现Cu_(2)O夹杂衍射峰.In this paper,the effects of 5,5-dimethylhydantoin(DMH)on electroless copper plating were studied in the solution containing sodium potassium tartrate and disodium ethylene diamine tetraacetic acid as the complexing agents,and formaldehyde as the reducing agent.The experimental results of the electroless copper plating show that DMH can improve the stability of the bath.SEM and appearance images show that DMH can reduce the particle size of the copper coating and make the coating brighter and more compact.UV-Vis absorption spectra reveal that DMH does not strongly coordinate with Cu(II)in the bath.Linear voltammetry curves illuminate that DMH can inhibit the generation of Cu^(+)ions or promote the reduction of Cu^(+)ions,and reduce the oxidation rate of the formaldehyde during electroless copper plating.XRD patterns show that the copper coatings obtained from the baths both with and without DMH present the same face-centered cubic multi-crystal structures.No Cu_(2)O diffraction peak is detected.

关 键 词：化学镀铜 双配位剂体系 5 5-二甲基乙内酰脲 镀液稳定性 

分 类 号：O646[理学—物理化学]